The traditional 16:9 mobile screen is rectangular with four sides at right angles. Because the front camera, distance sensor, receiver and other components are placed on the body, the screen and the upper and lower body edges have a certain distance. However, the screen share of 18:9 full screen mobile phones is generally greater than 80%, and the screen edge will be very close to the mobile phone body. If we continue to use the previous right angle scheme, there will be no place for relevant modules and components. At the same time, when the screen is close to the fuselage, it will bear more impact when it falls, resulting in screen fragmentation.
Therefore, it is very necessary to cut the abnormal shape of the screen. On the one hand, it is necessary to cut C or R corners at four corners of the screen, and at the same time, it is necessary to strengthen the edges by adding buffer foam, etc., to prevent screen fragmentation. On the other hand, U-shaped cutting is needed above the screen to reserve space for front camera, distance sensor, receiver and other components.
The current special-shaped cutting programs mainly include: cutter wheel cutting, laser cutting, and CNC grinding as a temporary alternative. Among them, the cutter wheel cutting is the most traditional cutting scheme with low cost. It is generally used for straight-line cutting with an accuracy of about 80um. The specific process of cutter wheel cutting is to first cut a cut on the glass with the cutter wheel, and then complete the crack by the crack machine.
At present, the main scheme of special-shaped cutting is to cut two C angles, two R angles and one u groove on the screen panel. In this scheme, arc cutting is the main way. If the cutter wheel cutting scheme is adopted, the edge collapse is serious. At the same time, the cutting efficiency of the cutter wheel is low. According to the industry chain research, because the cutter wheel cutting needs to reserve the cutting line, compared with laser cutting, the utilization rate of the cutter wheel cutting for the whole panel will decrease by 10-20%; cutting a piece will take 2-3 minutes. Therefore, after a short attempt, the cutter wheel shaped cutting has been gradually eliminated by the industry.
n contrast, laser cutting has obvious advantages in special-shaped cutting. Laser cutting is non-contact processing, no mechanical stress damage, and high efficiency. The same processing plan of two C angles, two R angles and one u groove can complete cutting in about 20 seconds.
The principle of laser cutting is to focus the laser on the material, heat the material locally until it exceeds the melting point, then blow the molten metal away with high pressure gas, and form a very narrow slit with the movement of the beam and the material. The precision of laser cutting can reach 20um.
There are many kinds of lasers, including solid and gas in terms of gain medium. Among them, solid-state lasers include Al2O3, YAG cutting, and gas lasers mainly include CO2 cutting. Generally speaking, the gas laser is usually 10.6um infrared light with a wide range of use. The solid-state laser is generally 1064nm infrared light with high output energy and peak power. At the same time, in addition to the long wavelength infrared laser, there is also a solid-state ultraviolet laser (wavelength from 180 to 400nm). UV cutting is more used to deal with polymer materials, through the destruction of molecular bonds on the surface of non-metallic materials, to achieve cutting. UV cutting is also known as cold laser, with small thermal effect.
According to the pulse width time of laser, it can be divided into nanosecond (NS, 10 ^ 9 seconds), picosecond (PS, 10 ^ 12 seconds) and femtosecond (10 ^ 15 seconds). The shorter the pulse width, the higher the peak power, the lower the thermal effect.
From the point of view of cutting scheme, laser cutting is divided into surface ablation and internal focusing cutting. Surface ablation can be cut through directly, without the need for subsequent increase of fragment process, and the heat affected area is large; after internal focusing cutting, the fragment separation process is required, and the heat affected area is small.
According to the industry chain survey, the current mainstream laser cutting machine is infrared solid picosecond laser, which adopts the internal focusing cutting scheme. The scheme achieves the maximum balance between cost and efficiency. Domestic manufacturers of panel laser cutting equipment mainly include: Han laser, Sheng Xiong laser, Delong laser, Xianhe laser, and foreign manufacturers are mainly Japanese Hirata.
At present, the downstream manufacturer of zhuorai laser industrial product line is Tianma, which provides Huawei and other domestic mobile phones with comprehensive screens. In addition, there are 4-5 large and medium-sized manufacturing enterprises. At present, the shipment volume of Zhuo radium laser ranks first in the Chinese market share. It is planned to sell 200-300 sets in 2018 and realize the output value of 60-90 million yuan.